发明名称 |
HIGH-MOLECULAR-WEIGHT EPOXY RESIN AND RESIN FILM, RESIN COMPOSITION, AND CURED ARTICLE USING HIGH-MOLECULAR-WEIGHT EPOXY RESIN |
摘要 |
<p>Provided is an epoxy resin (C) obtained by causing a bifunctional epoxy resin (A) containing at least 50 wt% of the epoxy resin (a) represented by General Formula 1, and a compound (B) having two phenolic hydroxyl groups per molecule to react in a solvent, the weight-average molecular weight in terms of a reference polystyrene by gel permeation chromatography (hereinafter, "GPC") being 30,000 to 80,000, wherein the epoxy resin can satisfy low linear expansion properties, self-film-formation properties, and handling properties (where n represents a repeating unit and is an integer 0 or greater).</p> |
申请公布号 |
KR20130118319(A) |
申请公布日期 |
2013.10.29 |
申请号 |
KR20137009933 |
申请日期 |
2011.10.20 |
申请人 |
NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. |
发明人 |
NAKANISHI TETSUYA;ASAKAGE HIDEYASU;UCHIDA MIYUKI |
分类号 |
C08G59/14;C08J5/18;C08J5/24;C09J7/02 |
主分类号 |
C08G59/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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