| 摘要 |
An ACF attachment method includes supplying an electronic component from a component supply unit, suctioning the electronic component, simultaneously attaching a first ACF to a first terminal surface of the electronic component and a second ACF to a second terminal surface of the electronic component, and providing an ACF attachment device which includes two ACF attachment units for attaching the first ACF and the second ACF. The first terminal surface is disposed on a first edge portion of the electronic component and the second terminal surface is disposed on a second edge portion of the electronic component. The two ACF units are positioned according to a space between the first terminal surface and the second terminal surface of the electronic component, and attaching the first and second ACFs is performed using the two ACF attachment units.
|
