| 摘要 |
An implantable device including a first electrically non-conductive substrate with a plurality of electrically conductive vias. The device also includes a flip-chip multiplexer circuit attached to the first substrate using conductive bumps, the circuit being electrically connected to at least a subset of the of the electrically conductive vias. Another flip-chip driver circuit is attached to the flip-chip multiplexer circuit using conductive bumps while a second electrically non-conductive substrate is attached to the flip-chip driver circuit, also using conductive bumps. Discrete passives are attached to the second electrically non-conductive substrate and a cover is bonded to the first substrate. The cover, the first substrate, and the electrically conductive vias form a hermetic package.
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