发明名称 |
Integrated circuit packaging system with shielding spacer and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a bottom integrated circuit over the substrate; connecting a bottom interconnect between the bottom integrated circuit and the substrate; and mounting a bottom shield-spacer above the bottom integrated circuit and the bottom shield-spacer includes a bottom shield plate above the bottom integrated circuit, a bottom shield pillar extending from a bottom shield foot and connected to the bottom shield plate, and a protuberance extending vertically above the bottom shield pillar and directly above the bottom shield foot.
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申请公布号 |
US8569870(B1) |
申请公布日期 |
2013.10.29 |
申请号 |
US201213531941 |
申请日期 |
2012.06.25 |
申请人 |
LEE SINJAE;PARK JONGVIN;YOON SUNG JUN;OH JIHOON;STATS CHIPPAC LTD. |
发明人 |
LEE SINJAE;PARK JONGVIN;YOON SUNG JUN;OH JIHOON |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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