发明名称 |
Luminous device with heat pipe and method of manufacturing heat pipe lead for luminous device |
摘要 |
The present invention relates to a luminous device with a heat pipe formed therein and a heat pipe lead for a luminous device. The present invention provides a luminous device including a heat pipe lead or electrode and a luminous chip mounted onto the heat pipe lead or electrode. The luminous device of the present invention further comprises a heat dissipation member, such as a heat radiating plate or thermoelectric device, installed at an end of the heat pipe lead or electrode. Therefore, through the heat pipe lead or electrode of the present invention, a higher heat dissipation effect greater can be obtained as compared with the conventional one. As a result, it is possible to reduce thermal stress on a luminous device and to prevent the occurrence of a phenomenon in which external impurities penetrate into the luminous device. In addition, the cooling efficiency and the light-emitting efficiency of a luminous chip can be maximized by further disposing a heat dissipation member outside the heat pipe.
|
申请公布号 |
US8569939(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US20050575292 |
申请日期 |
2005.08.26 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD.;KIM DO-HYUNG;SHIN MOON-WHAN;HWANG WOONG-JOON;LEE CHUNG-HOON |
发明人 |
KIM DO-HYUNG;SHIN MOON-WHAN;HWANG WOONG-JOON;LEE CHUNG-HOON |
分类号 |
H01J1/02;H01L33/52;H01J7/24;H01J61/52;H01K1/58;H01L33/62;H01L33/64 |
主分类号 |
H01J1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|