发明名称 |
Flexible printed circuit board |
摘要 |
An FPC board includes a base insulating layer. A plurality of wiring traces are formed on the base insulating layer. The adjacent wiring traces are arranged at a distance d from each other, and each wiring trace has a predetermined width and a thickness t1. Each transmission line pair is constituted by the two adjacent wiring traces of the plurality of wring traces. A ratio of the thickness t1 of the wiring trace to the distance d between the adjacent wiring traces is set to 0.8 or more. A cover insulating layer may be formed on the base insulating layer to cover the wiring traces. A metal layer having a predetermined thickness may be provided on a back surface of the base insulating layer. Furthermore, a differential impedance of each transmission line pair may be set to 100 Omega.
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申请公布号 |
US8569629(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US20100768258 |
申请日期 |
2010.04.27 |
申请人 |
OOKAWA TADAO;HONJO MITSURU;YAMAUCHI DAISUKE;NITTO DENKO CORPORATION |
发明人 |
OOKAWA TADAO;HONJO MITSURU;YAMAUCHI DAISUKE |
分类号 |
H05K1/00;H01B7/08;H05K1/03;H05K1/16;H05K1/18;H05K7/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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