发明名称 |
Passivating glue layer to improve amorphous carbon to metal adhesion |
摘要 |
A method and apparatus is provided for forming a resistive memory device having good adhesion among the components thereof. A first conductive layer is formed on a substrate, and the surface of the first conductive layer is treated to add adhesion promoting materials to the surface. The adhesion promoting materials may form a layer on the surface, or they may incorporate into the surface or merely passivate the surface of the first conductive layer. A variable resistance layer is formed on the treated surface, and a second conductive layer is formed on the variable resistance layer. Adhesion promoting materials may also be included at the interface between the variable resistance layer and the second conductive layer.
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申请公布号 |
US8569105(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US201213456058 |
申请日期 |
2012.04.25 |
申请人 |
CHENG SIU F.;PADHI DEENESH;APPLIED MATERIALS, INC. |
发明人 |
CHENG SIU F.;PADHI DEENESH |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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