发明名称 Passivating glue layer to improve amorphous carbon to metal adhesion
摘要 A method and apparatus is provided for forming a resistive memory device having good adhesion among the components thereof. A first conductive layer is formed on a substrate, and the surface of the first conductive layer is treated to add adhesion promoting materials to the surface. The adhesion promoting materials may form a layer on the surface, or they may incorporate into the surface or merely passivate the surface of the first conductive layer. A variable resistance layer is formed on the treated surface, and a second conductive layer is formed on the variable resistance layer. Adhesion promoting materials may also be included at the interface between the variable resistance layer and the second conductive layer.
申请公布号 US8569105(B2) 申请公布日期 2013.10.29
申请号 US201213456058 申请日期 2012.04.25
申请人 CHENG SIU F.;PADHI DEENESH;APPLIED MATERIALS, INC. 发明人 CHENG SIU F.;PADHI DEENESH
分类号 H01L21/00 主分类号 H01L21/00
代理机构 代理人
主权项
地址