发明名称 |
Polyamide resin composition and molded article |
摘要 |
Disclose is a polyamide resin composition having excellent heat resistance, heat aging resistance and mechanical physical properties, which is produced by incorporating a specified aromatic secondary amine compound and a specified organic sulfur based compound into a polyamide composed of a diamine unit containing a paraxylylenediamine unit as a major component and a dicarboxylic acid unit containing a linear aliphatic dicarboxylic acid unit having from 6 to 18 carbon atoms as a major component.
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申请公布号 |
US8569404(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US201013322499 |
申请日期 |
2010.05.28 |
申请人 |
OGAWA SHUN;SUMINO TAKAHIKO;MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
OGAWA SHUN;SUMINO TAKAHIKO |
分类号 |
C08K5/00;C08K5/34 |
主分类号 |
C08K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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