发明名称 |
Multilayer printed wiring board |
摘要 |
A multilayer printed wiring board in which interlayer insulation layer and conductive layer are formed on a multilayer core substrate composed of three or more layers, having through holes for connecting the front surface with the rear surface and conductive layers on the front and rear surfaces and conductive layer in the inner layer to achieve electric connection through via holes, the through holes being composed of power source through holes, grounding through holes and signal through holes connected electrically to a power source circuit or a grounding circuit or a signal circuit of an IC chip, when the power source through holes pass through the grounding conductive layer of the inner layer in the core substrate, of the power source through holes, at least a power source through hole just below the IC having no conductive circuit extending from the power source through hole in the grounding conductive layer.
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申请公布号 |
US8569880(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US20100869841 |
申请日期 |
2010.08.27 |
申请人 |
INAGAKI YASUSHI;SANO KATSUYUKI;IBIDEN CO., LTD. |
发明人 |
INAGAKI YASUSHI;SANO KATSUYUKI |
分类号 |
H01L23/522;H01L21/48;H01L21/60;H01L23/498;H01L23/50;H01L23/538;H01L23/66;H05K1/05;H05K3/42;H05K3/46 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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