发明名称 |
Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation |
摘要 |
An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.
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申请公布号 |
US8569872(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US20080166169 |
申请日期 |
2008.07.01 |
申请人 |
BATHAN HENRY DESCALZO;SHIM IL KWON;CAMACHO ZIGMUND RAMIREZ;CABLAO PHILIP LYNDON;CAPARAS JOSE ALVIN;STATS CHIPPAC LTD. |
发明人 |
BATHAN HENRY DESCALZO;SHIM IL KWON;CAMACHO ZIGMUND RAMIREZ;CABLAO PHILIP LYNDON;CAPARAS JOSE ALVIN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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