发明名称 III-V semiconductor devices with buried contacts
摘要 A semiconductor device such as a diode or transistor includes a semiconductor substrate, a first region of III-V semiconductor material on the semiconductor substrate and a second region of III-V semiconductor material on the first region. The second region is spaced apart from the semiconductor substrate by the first region. The second region is of a different composition than the first region. The semiconductor device further includes a buried contact extending from the semiconductor substrate to the second region through the first region. The buried contact electrically connects the second region to the semiconductor substrate.
申请公布号 US8569799(B2) 申请公布日期 2013.10.29
申请号 US201113331899 申请日期 2011.12.20
申请人 CURATOLA GILBERTO;POZZOVIVO GUANMAURO;HAEBERLEN OLIVER;INFINEON TECHNOLOGIES AUSTRIA AG 发明人 CURATOLA GILBERTO;POZZOVIVO GUANMAURO;HAEBERLEN OLIVER
分类号 H01L29/66 主分类号 H01L29/66
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