Integrated circuit packaging system with encapsulation and method of manufacture thereof

摘要

A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a rounded interconnect on the package carrier; mounting a conductive shield over the package carrier, the conductive shield having an elevated portion and a hole adjacent to the elevated portion with the elevated portion over the integrated circuit and the rounded interconnect exposed from the hole; and forming an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed.