发明名称 LED module with an LED semiconductor chip mounted on a silicon platform
摘要 An LED module having an LED semiconductor chip mounted directly or indirectly on a platform. The platform is made from silicon and extends laterally beyond the LED semiconductor chip having an active light emitting layer and a substrate. At least one electronic component that is part of the control circuitry for the LED semiconductor chip is integrated in the silicon platform.
申请公布号 US8569771(B2) 申请公布日期 2013.10.29
申请号 US20080527240 申请日期 2008.04.25
申请人 TASCH STEFAN;SHEPHERD NICK;LEXEDIS LIGHTING GMBH 发明人 TASCH STEFAN;SHEPHERD NICK
分类号 H01L27/15 主分类号 H01L27/15
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