发明名称 |
WAFER SUCTION DEVICE AND WAFER SUCTION METHOD |
摘要 |
PROBLEM TO BE SOLVED: To easily bond a film to a chuck and cause the elastic film to suction a wafer without causing unevenness of adhesion strength.SOLUTION: A wafer suction device includes: a planar chuck (10) formed by a rigid material and generating a suction effect on its upper surface by vacuum; and an annular fixing member (52) having an inner diameter larger than an outer diameter of the chuck and fixing an elastic film having a number of suction holes to the inner side thereof. The annular member is moved down relative to the chuck, and the elastic film is stretched over the chuck with a uniform tensile force to be supported. The wafer is suctioned and held on the stretched elastic film. |
申请公布号 |
JP2013222749(A) |
申请公布日期 |
2013.10.28 |
申请号 |
JP20120091883 |
申请日期 |
2012.04.13 |
申请人 |
TOKYO SEIMITSU CO LTD |
发明人 |
KANAZAWA MASAKI;FUJITA TAKASHI |
分类号 |
H01L21/304;B24B41/06;H01L21/683 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|