| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a bump, capable of preventing dissolution of a solder plating layer (tin-containing metal layer).SOLUTION: A method for forming a bump comprises the steps of: forming a seed layer on an outermost surface insulation resin layer and part of an exposed wiring layer; forming a resist layer having an opening corresponding to an opening of the outermost surface insulation resin layer, on the seed layer; forming a tin-containing metal layer on the seed layer in the opening of a resist; forming a protective film on the tin-containing metal layer; removing the resist layer; and removing the seed layer. |
