| 摘要 |
<p>PURPOSE: A liquid-cooled apparatus having a modular power semiconductor module and at least one capacitor device, and a power semiconductor module thereof are provided to prevent penetration of dust and moisture by being sealed with the capacitor device together. CONSTITUTION: An arrangement apparatus (100) has a number of modular power semiconductor modules (1) and at least one capacitor device. The power semiconductor module has a power electronic switching device (200 and a cooling device (10) to cool the power electronic switching device. The cooling device has a cooling volume (16) having at least one cooling surface (160) and four connecting devices (110,120,130,140) for the cooling liquid. The connecting devices are arranged on main sides (2a,2b) of the power semiconductor module as pair. The capacitor device is cooled directly or indirectly by a cooling circulation system of the arrangement apparatus.</p> |
