| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device that cools an integrated circuit through a heat sink, has a simplified structure and has an increased degree of freedom in layout of the integrated circuit and the heat sink.SOLUTION: An integrated circuit 31a is mounted on the upper surface of a circuit board 30. A heat pipe 12 includes a first portion 12a positioned above the integrated circuit 31a and a second portion 12b extending from the first portion 12a and positioned outside the outer edge of the integrated circuit 31a. An upper chassis 20 includes a plate spring part 21. The plate spring part 21 is attached to the upper surface of the circuit board 30 and presses the first portion 12a of the heat pipe 12 against the integrated circuit 31a. A heat sink 11 is connected to the second portion 12b of the heat pipe 12. |
