| 摘要 |
PROBLEM TO BE SOLVED: To provide a modular liquid-cooled power semiconductor module, and an arrangement therewith.SOLUTION: A modular power semiconductor module 1 has a basic parallelepipedal shape with two main sides 2a and 2b, two longitudinal sides 3a and 3b, and two narrow sides 4a and 4b which are opposite one another in respective pairs, a cooling device 10 which is capable of carrying a flow, a power electronics switch 20, and a housing 30. The cooling device 10 has a cooling volume 16 having at least one cooling face. The cooling device 10 further has four connection devices 110, 120, 130, and 140 for the cooling liquid 10 that are arranged in pairs on the main sides 2a and 2b and are designed as a flow inflow 110 and a flow outflow 120 and as a return inflow 130 and a return outflow 140, respectively. |
