发明名称 CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a circuit board and a manufacturing method therefor, capable of reducing an adverse effect caused by ringing while suppressing an increased size of the circuit board.SOLUTION: A ringing frequency, which is produced by series resonance of the parasitic capacitance of switching elements 61, 62 with the parasitic inductance of wiring, is calculated (S10, S11). For a circuit board 100, it is determined whether or not a noise caused by the ringing reaches a predetermined value. On determination of reaching the predetermined value, a frequency having a noise not reaching the predetermined value is determined (S12, S13). Then, the parasitic inductance is adjusted by an area on the surface side facing the wiring constituting a closed circuit 80 in GND wiring 50 in such a manner that the ringing frequency of the circuit board 100 becomes the determined frequency (S14).
申请公布号 JP2013223256(A) 申请公布日期 2013.10.28
申请号 JP20120091207 申请日期 2012.04.12
申请人 DENSO CORP 发明人 KOIDE NORIHISA;SENCHI MASATO
分类号 H02M3/155 主分类号 H02M3/155
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