| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an imaging element mounting substrate, which is capable of improving heat dissipation efficiency while preventing an increase in size and weight.SOLUTION: The heat dissipation structure of a wiring board (30) on which an imaging element (20) is mounted includes: recesses (31, 32) formed on that surface of the wiring board (30) which is opposite to a mounting surface of the imaging element (20); a heat dissipation member (40) provided on at least part of the recesses (31, 32); and through holes (TH1-TH3) which are provided in the wiring board (30), connect the mounting surface of the imaging element (20) and the heat dissipation member (40), and have higher thermal conductivity than the wiring board (30). |
