METHOD FOR MANUFACTURING INTERPOSER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an interposer adaptive to narrowing pitches and increasing pins of terminal connection for mounting a semiconductor chip to a semiconductor device, and a method for manufacturing the semiconductor device.SOLUTION: A method for manufacturing an interposer comprises: an arranging step of arranging a plurality of conductive linear bodies 11 at prescribed pitches P; a block body manufacturing step; a base material manufacturing step; a conductive layer forming step; a patterning step; and a multi-layers wiring layer forming step. In the arranging step, the pitch P is set so that a relation of 2D≤P<4D for a thickness D of the conductive linear body 11 is satisfied.