| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which avoids deformation of a substrate due to resin sealing during the manufacturing of the semiconductor module and peeling etc. of electronic components due to the deformation.SOLUTION: A dummy pattern 11 is formed at an entire or a part of a dicing line used when dividing and cutting an aggregate substrate 101 on a rear surface of the aggregate substrate 101. Alternatively, a solder resist for reducing irregularities on the rear surface of the aggregate substrate 101 is formed. This structure prevents deformation of the aggregate substrate 101 during resin molding, also prevents bump peeling of an IC and deformation of mounting components, and reduces the residual stress of the aggregate substrate 101. |
