METAL GRID IN BACKSIDE ILLUMINATION IMAGE SENSOR CHIPS AND METHODS FOR FORMING THE SAME

摘要

PURPOSE: A metal grid in backside illumination image sensor chips and a method for forming the same are provided to reduce optical crosstalk of a light received by different image sensors, by forming metal grids to isolate the light. CONSTITUTION: A plurality of image sensors (24) is formed on the front side of a semiconductor substrate (26). A dielectric layer is formed on the backside of the semiconductor substrate. The dielectric layer is patterned into a plurality of grid charging regions (42). A metal layer is formed between the upper surfaces and the side walls of the plurality of grid charging regions. A metal grid (44) is formed on the side walls of the plurality of grid charging regions. Grid open apertures of the metal grid are filled with a transparent material.