| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering film deposition method capable of forming a metal film having the same quality as that of a plated film of wet plating on a resin molding just by a dry process.SOLUTION: In a sputtering film deposition method of forming a metal film on a resin molding W immediately after being molded by sputtering of applying a DC high voltage to the resin molding W and a target 27 in an inert gas, a film forming pressure during sputtering is set to be 1 Pa or higher, a film forming temperature during sputtering is set to 20 to 60°C, an interval of the resin molding W and the target 27 during sputtering is set to 100 to 200 mm, and power of a sputtering power source 28 is set to be DC 20 KW or greater. |
