| 摘要 |
PROBLEM TO BE SOLVED: To provide a polysiloxane compound useful for a curable resin composition giving a cured product having excellent heat-resistance and adhesiveness, and a moisture-curable resin composition containing the compound.SOLUTION: There is provided a polysiloxane compound expressed by general formula (1) (in the formula, Rto Rare each independently 1-4C alkyl or 6-10C aryl; Rand Rare each independently 1-4C alkyl; Xis 1-4C alkyl, 6-10C aryl or 1-4C alkoxyl; (a) is a number to allow the compound expressed by general formula (1) to have a mass-average molecular weight of 2,000 to 1,000,000; and b is 0 or 1). |
