| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an insulation board, in which solder jointing property is good, occurrence of cracking or peeling is prevented, and further, manufacturing is of low cost.SOLUTION: A method of manufacturing an insulation board includes a lamination material manufacturing step S1 and a welding joint step S4. In the lamination material manufacturing step S1, an Ni layer 3 whose surface is jointed to a semiconductor element 21, a Ti layer 5, and a first AL layer 4 are jointed to be one body in a laminated state to produce a laminate material 2. In the welding joint step S4, the first Al layer 6 of the lamination material 2, a second Al layer 7, and a ceramic layer 8 are pressurized in a lamination direction, and under this condition, welding is made for collective jointing, thereby, a junction body 15 is obtained which includes, as one body, the lamination material 2, the second Al layer 7, and the ceramic layer 8. The second Al layer 7 which is used in the welding joint step S4 is made from an Al alloy plate of A1100 or A3003, and on both surfaces of the Al alloy plate, a welding material layer is jointed in advance respectively before the welding joint step. |
