| 摘要 |
The invention provides adhesive tape for wafer processing, which has uniform expansion suitable for application for truncating cement layers through expansion and sufficient shrinkage shown in a heating contraction process and results in no unfavorable conditions due to relaxation after the heating contraction process. The expansive adhesive tape 10 which is suitably applied for truncating a cement layer (13) along the wafer through expansion has a base material film 11 which is made of thermoplastic crosslinking resin provided with a Vickers softening point more than 50 DEG but less than 90 DEG as specified in JIS K7206 and having a stress increased over 9 MPa due to heating contraction. |
