| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal material for an electronic component, having high slight sliding abrasion resistance, high insertion-extraction resistance, low whiskering, and low insertion force properties.SOLUTION: In a metal material for an electronic component, an A layer comprising Sn, In, or an alloy thereof is formed on a substrate, a B layer comprising Ag, Au, Pt, Pd, Ru, Rh, Os, Ir, or an alloy thereof is formed between the substrate and the A layer, a C layer comprising one or more selected from the group consisting of Ni, Cr, Mn, Fe, Co, and Cu is formed between the substrate and the B layer. The thickness of the A layer is 0.01-0.3 μm, the thickness of the B layer is 0.05-0.5 μm, the thickness of the C layer is 0.05 μm or greater, and the ratio of the thickness of the A layer to the thickness of the B layer is 0.02-4.00. |
