| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus which improves the efficiency of heat transfer to a heat sink 10.SOLUTION: A heat transfer member 20 is mounted on one surface of a circuit board 90. A heat sink 10 is disposed so as to be spaced further away from the circuit board 90 than the heat transfer member 20. The heat sink 10 includes multiple fins 13 spaced away from each other and extending in a direction along the circuit board 90. Further, the heat sink 10 includes a support part 12 which extends in a direction that the multiple fins 13 are arranged, connects the multiple fins 13, and supports the multiple fins 13. Multiple heat pipes 31 are connected with the heat transfer member 20, are positioned so as to be separated from each other, and extend in a thickness direction of the circuit board 90 to be connected with the support part 12. |
