发明名称 |
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component.SOLUTION: The multilayer ceramic electronic component comprises: a ceramic main body including a dielectric layer; and first and second internal electrodes disposed to face each other within the ceramic main body and having the dielectric layer interposed therebetween. When an average roughness of center lines of the first and second internal electrodes is Ra, the maximum distance from a virtual line corresponding to said Ra to a pit d formed below the virtual line is in the range from 0.1 μm to 13 μm. This invention has an effect of improving the surface roughness of an internal electrode printed surface and decreasing short circuit failures. |
申请公布号 |
JP2013222958(A) |
申请公布日期 |
2013.10.28 |
申请号 |
JP20120145187 |
申请日期 |
2012.06.28 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
LEE JIN WOO;KIM TAE HYUN;KIM EUNG SOO;RO CHI HYOUN;CHOE HAN-KYU |
分类号 |
H01G4/232;H01G4/12;H01G4/30 |
主分类号 |
H01G4/232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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