| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding nozzle which stably mounts a lead component on a substrate and an electronic component mounting apparatus.SOLUTION: A holding nozzle comprises: a cylinder to or from which air is supplied or exhausted; a piston disposed in the cylinder and reciprocating; a movable piece connected with the piston and holding and releasing the lead component in conjunction with the reciprocating movement of the piston; a holding spring providing a force to the movable piece in a direction that the movable piece holds the lead component; a fixed piece contacting with the movable piece and holding the lead component; a pressing spring provided in the fixed piece; and a pressing part contacting with the lead component and pressing the lead component into the substrate using a pressing force of the pressing spring. |
