发明名称 INFRARED RAY SENSOR PACKAGE, INFRARED RAY SENSOR MODULE, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an infrared ray sensor package capable of keeping the gas adsorption performance of a getter while suppressing the performance deterioration of an infrared ray sensor element; an infrared ray sensor module; and an electronic apparatus.SOLUTION: An infrared ray sensor package 17 at least includes: an infrared ray sensor element 1; a base substrate portion 2; a housing portion 3; an infrared ray transmission window 5; and a getter 6a. The infrared ray sensor element 1 is vacuum-sealed in a space surrounded by the base substrate portion 2, the housing portion 3, and the infrared ray transmission window 5. The getter 6a is disposed in a cavity 9 between the infrared ray sensor element 1 and the base substrate portion 2 which is formed by disposing a spacer 8 between the infrared ray sensor element 1 and the base substrate portion 2. A shielding member 12 is disposed between the infrared ray sensor element 1 and the getter 6a, and the shielding member 12 is a heater for heating the infrared ray sensor element 1, or an element at least made from an alloy including Ni or heat-resistant glass.
申请公布号 JP2013222735(A) 申请公布日期 2013.10.28
申请号 JP20120091535 申请日期 2012.04.13
申请人 NEC CORP 发明人 YAMAZAKI TAKAO;KURASHINA HARUJI
分类号 H01L23/26 主分类号 H01L23/26
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