METHOD AND DEVICE FOR LASER PROCESSING OF MOVING SUBSTRATE

摘要

FIELD: process engineering.SUBSTANCE: invention relates to laser processing of moving substrate to obtain material separated from said substrate. In substrate processing, high pressure is maintained by the pump from substrate side whereto laser beam is irradiated rather than from opposite side. In substrate processing on both sides irradiated by laser beam guides are used.EFFECT: material separation by lower forces and without damages.29 cl, 7 dwg