APPARATUS AND METHOD FOR THE SINGULATION OF A SEMICONDUCTOR WAFER

摘要

PURPOSE: A singulation device of a semiconductor wafer and a method thereof are provided to increase the product amount by comprising dicing blades capable of simultaneously operating in a first direction and a second direction perpendicular to the first direction. CONSTITUTION: A semiconductor supporting body (102) is composed to support a wafer (103). Multiple dicing saws (106) are arranged in the shape of U throughout the whole edge of the wafer. The dicing saw comprises a motor (108). A dicing blade (110) is attached to a spindle (112) rotatably connected to the motor. The dicing blade simultaneously generates multiple cut lines (114) in parallel throughout a whole peripheral edge (105) on the surface of the wafer.