发明名称 CIRCUIT IMPRIME DIT LED AVEC COUPE EN FORME DE BOL ET PROCEDE DE FABRICATION
摘要 A method for manufacturing an LED circuit board with bowl like reflective cups12 includes the steps of combing a glass fiber layer 20 and a copper foil layer 25 to form a combining layer and attaching it to an upper surface of a copper substrate 10; drilling a plurality of penetrating holes 11 through the combining layer and the copper substrate; etching the copper foil; drilling the combining layer to form a plurality of cups; sandblasting; electroplating gold 30 to the copper foil layer of the combining layer for increasing electric conduction and heat dissipation; printing an insulating ink mask layer (or a paint) 40 on the upper surface of the gold layer; electroplating a plurality of metal joints 50 on the ink layer portions as electric joints; and removing parts of the insulating ink layer so as to expose the gold layer and baking the structure.
申请公布号 FR2989828(A3) 申请公布日期 2013.10.25
申请号 FR20130000218 申请日期 2013.02.04
申请人 WANG YU TIEN 发明人 WANG YU TIEN
分类号 H01L27/15;H01L21/77;H01L23/373;H05K1/18;H05K3/00 主分类号 H01L27/15
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