| 摘要 |
<p>A light emitting diode package is provided to improve optical efficiency and to emit light to a wide lateral orientation angle by preventing a light loss due to a total reflection. A substrate(21) has lead electrodes(23a,23b). A light emitting diode chip(25) is mounted on the substrate. A light permeable resin(29) has a lateral surface and an upper surface(29a). The light permeable resin covers the light emitting diode chip. A reflector(31) is located on the upper surface of the light permeable resin. The upper surface of the light permeable resin is a slopped surface so that light emitted from the light emitting diode chip to the upper surface of the translucent resin is reflected to the lateral surface of the light permeable resin by the reflector. An incident angle of the direct incident light from the light emitting diode chip to the lateral surface is less than a critical angle. The reflector is made of PPA(Phenylpropanolamine).</p> |
