发明名称 |
ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME |
摘要 |
An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C. |
申请公布号 |
US2013281559(A1) |
申请公布日期 |
2013.10.24 |
申请号 |
US201313924877 |
申请日期 |
2013.06.24 |
申请人 |
PARK BAEK SOUNG;SONG KI TAE;UH DONG SEON;KIM IN HWAN |
发明人 |
PARK BAEK SOUNG;SONG KI TAE;UH DONG SEON;KIM IN HWAN |
分类号 |
C09J163/00 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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