VAPOR DEPOSITION APPARATUS AND METHOD ASSOCIATED

摘要

A vapor deposition apparatus (1) includes a deposition chamber (4) for carrying out a deposition of a film on a substrate, source gas tubes (21) and (31) for supplying a source gas, a transfer unit (5) for transferring the substrate in the interior of the deposition chamber (4) so that the substrate is alternately situated in a state where the substrate is located in a deposition region that faces the gas discharge port for supplying the source gas and in a state where the substrate is located in other region except the deposition region, while the source gas is supplied from a gas discharge port of any one of the source gas tubes (21) and (31), and a supply tube (7) for supplying a gas containing group-V element to the substrate S located in the other region.