发明名称 |
ENHANCED PACKAGE THERMAL MANAGEMENT USING EXTERNAL AND INTERNAL CAPACITIVE THERMAL MATERIAL |
摘要 |
<p>An apparatus has external and/or internal capacitive thermal material for enhanced thermal package management. The apparatus includes an integrated circuit (IC) package having a heat generating device. The apparatus also includes a heat spreader having a first side that is attached to the IC package. The apparatus also includes capacitive thermal material reservoirs contacting the first side of the heat spreader. The capacitive thermal material reservoirs may be disposed laterally relative to the heat generating device.</p> |
申请公布号 |
WO2013158721(A1) |
申请公布日期 |
2013.10.24 |
申请号 |
WO2013US36907 |
申请日期 |
2013.04.17 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
CHIRIAC, VICTOR A.;LISK, DURODAMI J.;RADOJCIC, RATIBOR |
分类号 |
H01L23/42;H01L23/433 |
主分类号 |
H01L23/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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