PROTECTIVE TAPE SEPARATION METHOD AND PROTECTIVE TAPE SEPARATION DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce separation tape consumption and effectively recover protective tape separated from a wafer.SOLUTION: A protective tape separation method includes the steps of: sticking separation tape supplied at a prescribed pitch shorter than a diameter of a wafer on a separation starting side of a surface of the protective tape with prescribed width; separating the protective tape integrally with the separation tape from the surface of the wafer while returning the separation tape to the supply side, after sticking the separation tape on the separation starting side of the protective tape; sticking a rear surface of the protective tape which has been stuck in the previous separation step on the separation tape returned in the separation step on adhesive tape on the protective tape of a separation object; and sending out the separated protective tape overlapping each other to a taking-up direction. Taking-up recovery is performed by repeating the separating of the protective tape and the overlapping and sticking of the protective tape.