| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus which inhibits heat transmission between two components without complicating the structure.SOLUTION: In an electronic apparatus, a first component 20 and a second component 30 are mounted on a lead frame 10 and those components are sealed by a mold resin 40. Further, the first component 20 changes its characteristics when receiving heat from the exterior and the second component 30 causes the first component 20 to operate, thereby generating heat. In this structure, the mold resin 40 has a through hole 41 positioned between the first component 20 and the second component 30 and penetrating therethrough in a direction that the first component 20 and the second component 30 are mounted on the lead frame 10. The through hole 41 allows air having extremely small heat conductivity to be disposed between the first component 20 and the second component 30 and thus the heat transmission from the second component 30 to the first component 20 is inhibited. Further, the structure is formed by providing the through hole 41 in the mold resin 40, and thus the structure of the electronic apparatus does not become complicated. |
