| 摘要 |
PROBLEM TO BE SOLVED: To solve such problems that, in a high-temperature environment of 125°C or higher, a structure of a conventional low-Ag lead-free solder alloy exhibits low tensile strength and elongation thereof is deteriorated when being subjected to tension, and therefore, use in such a high-temperature environment as an automotive environment has been difficult.SOLUTION: A low-Ag-content lead-free solder alloy includes a content rate X wt.% Bi, a content rate Y wt.% Ag, a content rate Z wt.% Al, and the balance other than inevitable impurities being Sn, wherein X, Y and Z satisfy relation of 1.5≤X≤2.5, 0.01≤Y<0.5 and Y/8≤Z<Y/8+0.1, respectively. |
