| 摘要 |
An electrical circuit structure can include a first trace formed using a first conductive layer and a second trace formed using a second conductive layer. The first trace can be vertically aligned with the second trace. The electrical circuit structure can include a via segment formed of conductive material in a third conductive layer between the first conductive layer and the second conductive layer. The via segment can contact the first trace and the second trace forming a first conductor structure configured to convey an electrical signal in a direction parallel to the first conductive layer.
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