| 摘要 |
<p>A scanning and testing method based on three-dimensional chips comprises the following steps of: establishing a scanning forest structure which is used for three-dimensional chips (S201); generating a testing set and a testing cycle and dividing the testing set into a plurality of testing vector subsets (S202); sequencing the plurality of testing vector subsets and distributing testing vectors in the plurality of testing vector subsets in the testing cycle (S203); acquiring present hotspot distribution of the testing vector subsets (S204); sequencing the testing vector subsets on the basis of minimum hotspot temperature increase value of chips according to the scanning tree structure to generate a testing vector strategy (S205); according to the testing vector strategy, acquiring a vector subset whose hotspot temperature increase value does not exceed a preset temperature threshold in the sequenced testing vector subsets to generate a selected testing set (S206); and applying the scanning tree structure to the selected testing set and updating the hotspot distribution of the selected testing set (S207). The method can effectively shorten testing time and meanwhile reduce test incentive data and test response.</p> |
