| 摘要 |
<p>Provided is an inductor array chip that is not prone to structural defects during firing, and is easily manufactured in a stable manner. The inductance array chip (40) is provided with a magnetic layered laminate (41), and a plurality of inductors (L1, L2). The magnetic layered laminate (41) has a plurality of laminated magnetic layers (42). The plurality of inductors (L1, L2) is disposed inside the magnetic layered laminate (41). The inductance values of the plurality of inductors (L1, L2) differ from one another. Each of the plurality of inductors (L1, L2) has a plurality of coiled conductors (43a, 43b), and via-hole conductors (44a, 44b). Each of the plurality of coiled conductors (43a, 43b) is disposed between the magnetic layers (42). The via-hole conductors (44a, 44b) electrically connect the plurality of coiled conductors (43a, 43b). The plurality of inductors (L1, L2) includes a plurality of inductors in which the thickness of the plurality of coiled conductors (43a, 43b) differs.</p> |
