发明名称 Measuring device i.e. thermal flow rate measuring device, for measuring flow rate of fluid in automation technology, has solder uniformly distributed in recess so that defined distance between housing and thermistor component is adjusted
摘要 <p>The device has a cylindrical housing (11) including a step-like recess (20) at a front side (12) of a distal end. A flexible conductor film (2) is fed over the recess. The recess is arranged at an inner side of the housing, and receives a solder (21). The film is galvanically connected with the housing by the solder. The solder is uniformly distributed with a same thickness in the recess so that a defined distance between the housing and a thermistor component (3) i.e. platinum 100 component, in a region of the recess is adjusted, where the component is arranged on the conductor film. An independent claim is also included for a method for manufacturing a measuring device.</p>
申请公布号 DE102012206647(A1) 申请公布日期 2013.10.24
申请号 DE201210206647 申请日期 2012.04.23
申请人 IFM ELECTRONIC GMBH 发明人 LIEHR, SEBASTIAN;REICHART, STEPHAN;REICHART, WALTER
分类号 H01L23/043;G01F1/684;G01F23/22;G01K7/16;G01L19/00;G01P5/10;H01L21/52 主分类号 H01L23/043
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