| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which inhibits the deterioration of the production yield of an LED package, reduces the costs, and inhibits the reduction of the luminous efficiency, and to provide an LED package formed using the substrate for mounting the light emitting element.SOLUTION: According to one embodiment of this invention, a substrate 1 for mounting a light emitting element includes: a plate like insulative base material 2 having through holes 9a, 9b; metal films 4a, 4b formed on one surface of the base material 2 through an adhesive layer 3; embedded metals 5a, 5b which are respectively embedded in the through holes 9a, 9b and are respectively connected with the metal films 4a, 4b; and a resin sealing dam 6 formed on the one surface of the base material 2. The elastic modulus of at least one of the base material 2 and the adhesive layer 3 is smaller than the elastic moduli of the metal films 4a, 4b. The through holes 9a, 9b are positioned at the inner side of an element mounting region R enclosed by a bottom side of exposed inner side surfaces of the resin sealing dam 6. |
