发明名称 SYSTEM AND METHOD FOR IMPLEMENTING A SINGLE CHIP HAVING A MULTIPLE SUB-LAYER PHY
摘要 A system and method are disclosed for supporting 10 Gigabit digital serial communications. Many of the functional components and sublayers of a 10 Gigabit digital serial communications transceiver module are integrated into a single IC chip using the same CMOS technology throughout the single chip. The single chip includes a PMD transmit/receive CMOS sublayer, a PMD PCS CMOS sublayer, a XGXS PCS CMOS sublayer, and a XAUI transmit/receive CMOS sublayer. The single chip supports both 10 Gigabit Ethernet operation and 10 Gigabit Fibre Channel operation. The single chip interfaces to a MAC, an optical PMD, and non-volatile memory.
申请公布号 US2013279551(A1) 申请公布日期 2013.10.24
申请号 US201313924082 申请日期 2013.06.21
申请人 BROADCOM CORPORATION 发明人 FUJIMORI ICHIRO;HOANG TUAN;TAN BEN;LONGO LORENZO
分类号 H04B1/40;H04L12/56 主分类号 H04B1/40
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