发明名称 |
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES |
摘要 |
Methods for forming semiconductor device packages include applying an underfill material over a semiconductor wafer including conductive elements such that an average thickness of the underfill material is at least about 80% of an average height of the conductive elements and each conductive element is covered by underfill material. Underfill material covering tips of conductive elements is removed. Other methods include positioning a stencil over a semiconductor wafer and applying an underfill material to a major surface of the semiconductor wafer through the stencil. Additional methods include aligning and associating conductive elements having a surface substantially free of underfill material with bond pads of a substrate, melting and flowing the underfill material, and heating the conductive elements and underfill material to melt tip portions of the conductive elements and cure the underfill material. |
申请公布号 |
US2013280861(A1) |
申请公布日期 |
2013.10.24 |
申请号 |
US201213454598 |
申请日期 |
2012.04.24 |
申请人 |
MA ZHAOHUI;ZHOU WEI;YU AIBIN;MICRON TECHNOLOGY, INC. |
发明人 |
MA ZHAOHUI;ZHOU WEI;YU AIBIN |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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