METHOD FOR DISMANTLING ELECTRONIC COMPONENTS ON A CIRCUIT BOARD BY FINE SAND

摘要

The present invention relates to the field of circuit board recycling. A method used for dismantling electronic components on a circuit board by fine sand, said method comprising: depositing fine sand on the surface of a heating device used for heating said fine sand; heating said fine sand by means of said heating device, causing the temperature of the sand to be above the melting point of the solder on the pins of the electronic components on a circuit board; bringing the side of the circuit board having few or no electronic components into contact with the fine sand so as to melt the solder, thereby dismantling the electronic components on the circuit board. In the present method, the surface area of contact is large, heating is uniform, the solder melts rapidly, cost and energy consumption are low, operation is convenient, and there is no secondary pollution.